Helen Frankenthaler PCB Circuit Board R&D Center

rigid flex pcb board

PCB Manufacturing, PCB Assembling & PCB Designing - Auspi Enterprises

FPC

Flex PCB / Flexible PCB

Flexible circuit board, also known as flex circuit board, is a special type of printed circuit board where the board has at least a portion which is bendable. Typical use case of flex circuits is referred to as FFC (flexible flat cable) and is used as replacement of cable wires and connectors, in which case the flex circuit is designed without electronic components. Other common use includes components assembled on the flex circuit such as led strip and LCD panel interface.

The electronic circuit is designed on flexible plastic substrate, usually polyimide film for its high heat resistance which makes is suitable for solder mounting components. In some cases polyester film may used as substrate material, where heat resistance is not needed and no components are soldered on the board. Instead, the board is printed with an industrial printer capable of dispensing conductive ink such as silver ink or carbon ink onto the polyester substrate. Examples of use are touch sensors in computer keyboards for key press detection.

FPC APPLICATION

Flex circuits are often used as connectors in various applications where flexibility, space savings, or production constraints limit the serviceability of rigid circuit boards or hand wiring. A common application of flex circuits is in computer keyboards; most keyboards use flex circuits for the switch matrix.

In LCD fabrication, glass is used as a substrate. If thin flexible plastic or metal foil is used as the substrate instead, the entire system can be flexible, as the film deposited on top of the substrate is usually very thin, on the order of a few micrometres. Our FPC capabilities.

Capabilities

SortItemNormal capabilitySpecific capability
Layer countRigid-flex PCB2 ~142 ~24
Flex PCB1 ~101 ~12
BoardMin. Thickness0.08 +/- 0.03mm0.05 +/- 0.03mm
Max. Thickness6mm8mm
Max. Size485mm * 1000mm485mm * 1500mm
Hole & SlotMin.Hole0.15mm0.05mm
Min.Slot Hole0.6mm0.5mm
Aspect Ratio10:0112:01
TraceMin.Width / Space0.05 / 0.05mm0.025 / 0.025mm
ToleranceTrace W / S± 0.03mm (W/S≥0.3mm:±10%)± 0.02mm (W/S≥0.2mm:±10%)
Hole to hole± 0.075mm± 0.05mm
Hole Dimension± 0.075mm± 0.05mm
Impedance0 ≤ Value ≤ 50Ω : ± 5Ω 50Ω ≤ Value : ± 10%Ω
MaterialBasefilm SpecificationPI : 3mil 2mil 1mil 0.8mil 0.5mil
ED&RA Cu : 2OZ 1OZ 1 / 2OZ 1 / 3OZ 1 / 4OZ
Basefilm Main supplierShengyi / Taiflex / Dupont / Doosan / Thinflex
Coverlay SpecificationPI : 2mil 1mil 0.5mil
LPI ColorGreen / Yellow / White / Black / Blue / Red
PI StiffenerT : 25um ~250um
FR4 StiffenerT : 100um ~2000um
SUS StiffenerT : 100um ~400um
AL StiffenerT : 100um ~1600um
Tape3M / Tesa / Nitto
EMI shieldingSilver film / Copper / Silver ink
Surface finishOSP0.1 - 0.3um
HASLSn : 5um - 40um
HASL(Leed free)Sn : 5um - 40um
ENEPIGNi : 1.0 - 6.0um Ba : 0.015-0.10um Au : 0.015 - 0.10um
Plating hard goldNi : 1.0 - 6.0um Au : 0.02um - 1um
Flash goldNi : 1.0 - 6.0um Au : 0.02um - 0.1um
ENIGNi : 1.0 - 6.0um Au : 0.015um - 0.10um
Immesion silverAg : 0.1 - 0.3um
Plating TinSn : 5um - 35um
SMTType0.3mm pitch Connectors
0.4mm pitch BGA / QFP / QFN
0201 Component

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HOW AUSPI HELP YOU ?

With over 20 years of experience, Auspi has firmly established itself as a leader in client satisfaction across diverse industries. Our strategically positioned facilities in the Americas, Europe, and Asia allow us to effectively meet both your geographical and cost requirements. We carefully balance quality and affordability, ensuring that every penny you invest delivers exceptional value.

In the fast-evolving and competitive electronics industry, we remain agile and innovative. By continuously expanding our service offerings, we ensure that we not only meet but exceed the expectations of our valued partners. Your success is our priority, and we are dedicated to staying at the cutting edge of industry advancements to support your growth.

01/ Reliability
  • Full Compliance with NDA Requirement;
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  • Good Quality Performance & Keep Improving;
  • Honoring Our Commitments