Helen Frankenthaler PCB Circuit Board R&D Center

rigid flex pcb manufacturing process

Professional Rigid Flex PCB Manufacturing

Capabilities

Rigid Flex PCB Manufacturer

Rigid Flex PCB Manufacturing and Assembly in the USA

Blind Buried Circuits offers high-quality rigid-flex printed circuit board manufacturing and assembly for all your product development needs. As a leading manufacturer and assembler of rigid-flex PCBs in the USA, we take pride in providing our customers with high-quality printed circuit boards that meet their custom PCB requirements.

What are Rigid-Flex PCBs?

The Rigid-Flex PCBs combine rigid and flex materials, which helps customized products fit specific needs. It can be laminated in different thicknesses and accommodate many layers. The designers ensure that the traces are designed in a way that helps multiple bends and folds fit into the tight spaces. Rigid-Flex PCBs are mainly used in medical devices, aerospace systems, and military applications. They are mainly used in products with limited space and require high reliability and performance.

Blind Buried Circuits Manufacturing and Assembly Capabilities

We stock rigid and flex materials like polyimide materials in stock to keep the lead time as quick as possible. Our state-of-the-art manufacturing and assembly equipment maximize the designs’ efficiency. With skilled technicians, we deliver the highest quality standards to our customers. With the highest quality standards, our competitors unmatch our capabilities, and we thrive on serving our customers with the best customer support to optimize manufacturing lead times.

Rigid Flex PCB Design Guidelines

The below chart shows our various materials and manufacturing capabilities. Please feel to contact our engineering team at pcb@frankenthalerfoundation.org.

PANEL AND LAYER ATTRIBUTES
AttributesFlex Printed Circuit BoardRigid-Flex Printed Circuit Board
Layer Count10A maximum of 4
Thickness of CopperHoz and higher.¼ to Hoz.
Line Spacing and Width0.003”0.003”
Panel Size Standard9.84” x 15.75”3.94” x 3.94”
VIA & DRILL ATTRIBUTES
AttributesFlex Printed Circuit BoardRigid-Flex Printed Circuit Board
Minimum Micro Via (Laser) Size3 mil1 mil
Minimum Via (Laser) Size1 mil1 mil
Minimum Drill (Mechanical) Hole Diameter0.008”0.006”
Zif Tolerance2 mil1 mil
Tooling Tolerance2 mil1 mil
SHIELDING AND STIFFENER MATERIALS
AttributesFlex Printed Circuit BoardRigid-Flex Printed Circuit Board
Shielding MaterialCopper/Silver Ink/Tatsuta/CarbonCopper/Silver Ink/Tatsuta/Carbon
Stiffener MaterialPolyimide/FR4/MetalPolyimide/FR4/Metal
PI Stiffener Registration10 mil10 mil
PI Stiffener Thickness Tolerance10%10%
FR4 Stiffener Registration10 mil10 mil
FR4 Stiffener Thickness Tolerance10%10%
SOLDER MASK AND COVERLAY ATTRIBUTES
AttributesFlex Printed Circuit BoardRigid-Flex Printed Circuit Board
Registration (Solder Mask)5 mil4 mil
Registration Tolerance (Solder Mask)5 mil5 mil
Bridging between Dam (Solder Mask)4 mil3 mil
Registration (Coverlay)7 mil5 mil
PIC Registration (Coverlay)7 mil4 mil
LEGENT / SILK SCREEN ATTRIBUTES
AttributesFlex Print