Helen Frankenthaler PCB Circuit Board R&D Center

rigid pcb characteristics

Flex PCB Technical Capabilities

Flex PCB Technical Capabilities

FPC Layer

NO.ITEMStandard CapabilitiesSpecial Capabilities
1FPC Layer1-12L1-16L

FPC Material

NO.ITEMStandard CapabilitiesSpecial Capabilities
2Base MaterialPI (12.5um, 25um, 50um)100um
3Copper TypeRA Copper: 12um, 18um, 35um, 70um ED Copper: 12um, 18um, 35um, 70um6um, 9um, 100um
4PI Coverlay12.5um, 25um, 50um100um
5AdhesivePSA Adhesive: 50um-100um (3M467, Tesa 8853, Tesa 8854, etc.)
6Hot-Press Adhesive13um, 25um
7StiffenersPI Stiffener: 12.5/25/50/75/100/125/150/200/250 (um) PET Stiffener: 0.125/0.188/0.25(mm) FR4 Stiffener: 0.1mm-2.0mm SUS Stiffener: 0.1mm-0.6mm Aluminum Stiffener: 0.2mm-2.0mm2mm
8EMI shielding filmHCF-6000G, PC800, etc.100um

Board Size & Thickness

NO.ITEMStandard CapabilitiesSpecial Capabilities
9Biggest Board Size500mm*600mm
10Longest Board Size1-2L: 4000mm 3-4L: 2480mm
11Biggest Board Thickness2.0mm
12Thinnest Board Thickness0.05mm
13Thickness Tolerance0.05mm~0.24mm: ±0.03mm 0.25mm~0.47mm: ±0.05mm

Drill

NO.ITEMStandard CapabilitiesSpecial Capabilities
14Minimum Hole Size0.1 mm0.025mm
15Holes Size Tolerance±0.05 mm
16Holes Posistion Tolerance±0.05 mm
17Minimum vias Pad Size0.3mm0.2mm
18Minimum Annular Ring Size0.1mm0.075mm
19Blind/Buried ViasYes

Copper Tracks and Plating

NO.ITEMStandard CapabilitiesSpecial Capabilities
20Minimum Track Width/Space (70um Copper)0.15mm/0.2mm0.1mm/0.15mm
21Minimum Track Width/Space (35um Copper)0.1mm/0.1mm0.075mm/0.075mm
22Minimum Track Width/Space (18um Copper)0.07mm/0.07mm0.05mm/0.05mm
23Minimum Track Width/Space (12um Copper)0.04mm/0.04mm0.035mm/0.035mm
24Track Width Tolerance20%0.02mm
25Tracks/Pads Position Tolerance≥0.06 mm≥0.05 mm
26Tracks/Pads To Board Edge≥0.15 mm≥0.05 mm
27Golden Finger Pitch TolerancePitch:10~20mm : ± 0.03mm, Pitch:20~50mm : ± 0.05mm
28Copper Plating Thickness8-20um
29Hole Copper Thickness8-20um35um
30Minimum Copper Thickness for Hollow Out FPC35um

Surface Finish

NO.ITEMStandard CapabilitiesSpecial Capabilities
31ENIGAU: 1-2u" Thickness NI: 40-120u" Thickness3u” Thickness
32Electrolytic Nickel Gold (Hard Gold Plating)AU: 1-50u” Thickness NI: 80-320u" Thickness
33Immersion SilverAg: 6-12u" Thickness
34OSP8-16u" Thickness
35Immersion TinSN: 10-60u" Thickness
356Tin PlatingSN: 5-30um Thickness
37ENEPIGAu:1-4u" Thickness NI: 120-200u" Thickness Pd:1-6u" Thickness

Coverlay

NO.ITEMStandard CapabilitiesSpecial Capabilities
38Coverlay Opening Size Tolerance±0.1 mm±0.03 mm
39Minimum Drilling Size on Coverlay Opening0.45mm0.2mm
40Minimum Square Size on Coverlay Opening0.7mm*0.7mm0.2mm*0.2mm
41Coverlay Opening Position Tolerance±0.1 mm±0.03 mm
42Coverlay Align Tolerance±0.1 mm±0.02 mm
43Excessive Glue≤0.15 mm
44Minimum Area of Excessive Glue≤20% Pads Area

Solder Mask and Silkscreen

NO.ITEMStandard CapabilitiesSpecial Capabilities
45Solder Mask Thickness15um +/-5um
46Solder Mask Tolerance For Opening Size+/-0.05mm+/-0.02mm
47Solder Mask Tolerance For Opening Position0.1mm+/-0.02mm
48Minimum Silkscreen line width0.13mm
49Minimum Silkscreen Gap0.2mm
50Minimum Silkscreen Position Tolerance+/-0.3mm
51Minimum Silkscreen height0.8mm
52Minimum Solder Mask Bridge0.13mm

Board Outline & Stiffeners

NO.ITEMStandard CapabilitiesSpecial Capabilities
53Board Outline Tolerance with Steel Die±0.1 mm±0.03mm
54Board Outline Tolerance with Knife Die±0.2 mm
55Minimum Gap Between Drilling and Board Edge≥0.5 mm
56PSA Position Tolerance±0.2 mm
57Stiffeners Position Tolerance±0.2 mm

FPC E-Test

NO.ITEMStandard CapabilitiesSpecial Capabilities
58Test Voltage10-50V
59Insulation Test Impedance≥10MΩ
60Conduction Test Impedance≤50Ω
61Impedance Tolerance10%

FPC Physical Property

NO.ITEMStandard CapabilitiesSpecial Capabilities
62Solderability Test245±5℃, 3 Seconds For One Time, Soldering Area≥95%
63Thermal Shock Test288±5℃, 10 Seconds Per 3 Times, No Delamination and No Bubbles
64FCCL Peel Strength≥0.8kgf/㎠ (1cm width sample)
65Coverlay Peel Strength≥0.8kgf/㎠ (1cm width sample)
66Stiffeners Peel Strength0.15 N/mm (Hot-Press Adhesive) 0.49 N/mm (PSA Adhesive)