Helen Frankenthaler PCB Circuit Board R&D Center

rigid pcb market

Rigid PCB Capabilities - LionCircuits

Rigid PCB Capabilities - LionCircuits

LionCircuits, a global leader in PCB manufacturing, offers complete EMS solutions through our software-driven platform. From prototyping to production, we streamline PCB fabrication, assembly, and component sourcing. Explore our capabilities and reach out for tailored support.

Explore our Rigid PCB services: Choose from Make in India, Custom designs, or Rush delivery for fast, reliable, and affordable solutions.

Rigid PCB Service Specifications

SpecificationMII ServiceCustom ServiceRush Service
Minimum Board Dimension3mm * 3mm3mm * 3mm3mm * 3mm
Board Layers2 and 4 Layers1,2,4,6,8,10,12 Layers. *6 and above layer Boards on pcb@frankenthalerfoundation.org1,2,4,6,8,10,12 Layers. *6 and above layer Boards on pcb@frankenthalerfoundation.org
Copper Weight1oz(35um)1oz(35um), 2oz(70um), 3oz(105um)1oz(35um),2oz(70um)
Board Thickness Tolerance± 10%± 10%± 10%
Minimum trace spacing/widthFor 1oz: 6/6milFor 1oz: 6/6 mil For 2oz: 10/10 mil For 3oz: 12/12 milFor 1oz: 8/8mil For 2oz: 10/10mil
Annular Rings0.152mm/6mil0.152mm/6mil0.152mm/6mil
Minimum distance between Trace and Copper PourFor 1oz = 6milFor 1oz = 6mil For 2oz = 10mil For 3oz=12milFor 1oz = 8mil For 2oz = 12mil
Circuit to edge= 0.3mm /12mil= 0.3mm /12mil= 0.3mm /12mil
Minimum distance between Vias (plated holes)= 12mil= 10mil= 14mil
Minimum distance between Silk Screen and Solder Pad= 6mil= 6mil= 8mil
Width of Solder Mask Dam=0.152mm/6mil=0.152mm/6mil=0.25mm/10mil
Minimum distance between Via(plated holes) and trace= 12mil= 10mil= 14mil
Drill Hole Diameter(Mechanical)0.35 - 6.3mm0.25 - 6.3mm0.4 - 6.3mm
Minimum silkscreen height/trace widthheight = 0.5842mm /23mil trace width = 0.152mm /6milheight = 0.5842mm /23mil trace width = 0.152mm /6milheight = 0.5842mm /23mil trace width = 0.152mm /6mil
Edge CastellationNoYesNo
Minimum diameter for slots0.8mm0.8mm0.8mm
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PCB File Extensions and Layers

In PCB design, specific file extensions are crucial for accurate fabrication. The Top Copper Layer (GTL) and Bottom Copper Layer (GBL) define the circuitry, while the Top (GTS) and Bottom Solder Mask (GBS) files specify solder mask application areas. The Top (GTO) and Bottom Silk Screen (GBO) files provide markings for component placement. The Board Outline file (GKO) defines the PCB's shape, and the Drills file (DRD) details hole locations for component mounting, ensuring precise manufacturing and functionality.

File ExtensionLayer
filename.GTLTop Copper Layer
filename.GBLBottom Copper Layer
filename.GTSTop SolderMask
filename.GBSBottom SolderMask
filename.GTOTop SilkScreen
filename.GBOBottom SilkScreen
filename.GKOBoard Outline
filename.DRDDrills
prototype to production: With you at every step

Multi-Layer PCB

support multilayer printed circuit boards upto 12 layers including impedance control.

  • 7628, 2116, 2113, 1080 and 106 type prepreg, other prepreg type can be procured on request.
  • Core material: NP-140, NP-170, 185HR and 370HR grade. We support other special core on request.
  • Inner/Outer layer copper finish can be 1oz or 2 oz.
standard file format

Layer-by-layer precision: Our standard file format ensuring seamless 4 and 6-layer PCB designs, ready for accurate fabrication.

PCB Assembly

Assemble with precision, deliver with confidence. Our PCB assembly services offer tailored solutions for seamless integration.

  • Assembly Types: Surface mount and through hole assembly on one or both sides of the PCB.
  • Assembly Quality: Fully automated state-of-the-art assembly line for unparalleled quality, reliable and timely delivery.
  • Stencil Options: Support for both frameless and framed stainless steel metal stencils for solder paste application. Framed stencils mandatory for certain components.
  • Lead Options: Both leaded and lead-free (RoHS) assembly options available.
  • Minimum Board Size: 50mm x 100mm for machine assembly, smaller boards need to be panelized.
  • Component Support: Components in Reel, Cut-tapes, and Tray formats supported.
  • Circuit Board Shape: Non-rectangular boards must be panelized with side rails (5mm) on the longer edge for machine assembly.
begin with BOM upload

PCB Component Sourcing

support multilayer printed circuit boards upto 12 layers including impedance control.

  • Turn-Key Assembly (Full Turn-Key and Partial Turn-Key Support)
  • Component Procurement Tool with BOM Management Software
  • SMT Stencil Options (Frameless and Framed)
BOM Management and Component Procurement

Our BOM Management Software and Component Procurement Tool are integral parts of our turn-key assembly services. These tools are designed to streamline the process of refining BOMs (Bill of Materials) and efficiently sourcing components for your projects. With our software-driven approach, you can easily optimize your BOMs, identify the right vendors and part numbers, and ensure a smooth ordering process for components. Our goal is to simplify the procurement journey and provide you with a comprehensive solution for managing your assembly requirements.

Automatic Assembly Selection

Selecting 'Automatic Assembly' is a crucial step in choosing the right stencils for your assembly process. Our Automatic Assembly feature ensures compatibility and optimal performance with our SMT stencil options. To guide you through this selection process and ensure seamless integration with our assembly services, we provide comprehensive guidance and support. Explore the benefits of Automatic Assembly and make informed decisions for your projects by following our expert guidance.

SMT Stencil Options

When it comes to SMT (Surface Mount Technology) stencil options, we offer a range of choices to meet your specific needs. Our offerings include both frameless and framed stainless steel metal stencils for solder paste application. It's important to note that framed stencils are essential, especially for components like BGA, QFN, or 0402 components, even for prototype quantities. To delve deeper into our SMT stencil options and understand their significance, click the button below to learn more about SMT Stencils.

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Functional Testing

support multilayer printed circuit boards upto 12 layers including impedance control.

Advanced Intelligence-Driven Visual Inspection

Upon completion of the PCBA process, we utilize our proprietary machine learning-based Advanced Intelligence-Driven visual inspection system. This system is designed for quality assurance, leveraging AI algorithms to detect defects and anomalies. With each test cycle, the system continuously learns and improves its accuracy, ensuring optimal performance.

  • Current Pass Rate
Additional Functional Testing

In addition to visual inspection, we conduct a range of functional tests to validate the board's performance

  • Short/Open check
  • device-fireware-upgrades (DFU)
  • Digital/analog testing
  • power-up testing
  • Votage tests on board
Specialised testing for batch sizes and components

Specialised testing for components & batch sizes

Tailored testing solutions to ensure the quality and reliability of your components, regardless of batch size

  • For batch sizes of 50 or more, we recommend defining a customized test procedure to meet your specific requirements.
  • We support Device Firmware Upgrades and Test Firmware using standard Jigs for boards with microcontrollers.
  • BGA/QFN assemblies undergo rigorous inspection using an X-ray inspection system to ensure quality and reliability.
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