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Taconic HDI PCB for Consumer Electronics

Products | AKM Meadville

hdl pcb engineering design

Advanced HDI PCBs

High volume, reliable advanced HDI products

  • with up to 16 layer any layer
  • 40/40um L/S
  • Fine pitch BGA
  • Up to 77G Hz High speed material hybrid HDI
  • Heavy Cu, Coin and novel thermal solutions

Advanced HDI PCBs

High volume, reliable advanced HDI products

  • with up to 16 layer any layer
  • 40/40um L/S
  • Fine pitch BGA
  • Up to 77G Hz High speed material hybrid HDI
  • Heavy Cu, Coin and novel thermal solutions

SLP (Substrate-like-PCB) PCBs

High volume, reliable Substrate-like-PCB (SLP) products

  • with Modified Semi-additive (mSAP) technology
  • 30/30um L/S
  • Fine pitch Fan-out Wafer
  • Level Package with large I/OS

SLP (Substrate-like-PCB) PCBs

High volume, reliable substrate-like-PCB (SLP) products with Modified Semi-Additive (mSAP) technology

  • 30/30um L/S
  • Fine pitch Fan-out Wafer
  • Level Package with large I/OS

IC Substrates

Ultra thin, highly customized module substrates

  • 20/40um Subtractive, 20/30um mSAP L/S
  • 150um Pitch Flip-chip CSP
  • <0.2mm 6L Core/Coreless substrate
  • BT/FR5 Ultra low CTE, Low loss, LED module Application Material
  • 2.5D Cavity, Embedded Pattern, Distributive buried capacitance and buried resistance layer
  • Solder-on-Pad (SOP Technology)

IC Substrates

Ultra thin, highly customized module substrates

  • 20/40um Subtractive, 20/30um mSAP L/S
  • 150um Pitch Flip-chip CSP
  • <0.2mm 6L Core/Coreless substrate
  • BT/FR5 Ultra low CTE, Low loss, LED module Application Material
  • 2.5D Cavity, Embedded Pattern, Distributive buried capacitance and buried resistance layer
  • Solder-on-Pad (SOP Technology)

Flex / Flex-assembly /Rigid Flexible (HDI) PCBs

Flex, Flex-assembly, Rigid-flex

  • with advanced HDI / any layer technology
  • 40/40um L/S
  • Fine pitch devices
  • 12um PI, 10um Coverlay ultra thin thickness
  • Dynamic bend / Install bend / Semi-Flex
  • Symetrical/Unsymmetrical structures
  • PI and low loss PI/LCP materials
  • Customized assembly and testing

Flex / Flex-assembly / Rigid Flexible (HDI) PCBs

Flex, Flex-assembly, Rigid-flex with advanced HDI / any layer technology

  • 40/40um L/S
  • Fine pitch devices
  • 12um PI, 10um Coverlay ultra thin thickness
  • Dynamic bend / Install bend / Semi-Flex
  • Symetrical/Unsymmetrical structures
  • PI and low loss PI/LCP materials
  • Customized assembly and testing