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Resource Title & SummaryDate UpdatedDocument Type
Isola featured at OEM Forum "The Heat is On! Finding PCB Materials that Like It Hot!"03/11/2021Presentation
PCB Material Selection for RF, Microwave and Millimeter-wave Design11/22/2016Presentation
New Thermoset PCB Materials Improve Millimeter Wave Performance and Reliability at Reduced Cost03/30/2017Presentation
Understanding Glass Fabric10/26/2023Presentation
New Thermoset PCB Material Emerging for mmWave Applications11/22/2016Article
Stack-up and routing optimization by understanding micro-scale PCB effects11/30/2020Technical Paper
Thermosets' Cost and Reliability Advantages for Automotive Radar PCBs11/30/2020White Paper
Fire Retardancy What, Why and How11/30/2020White Paper
Utilizing Thermal Fatigue Testing to Differentiate the Performance of Epoxy Materials at Various Glass Transition Temperature Levels11/30/2020Technical Paper
Thermal Reliability of Laser Ablated Microvias and Standard Through-Hole Technologies as a Function of Materials and Processing11/30/2020Technical Paper
The Effect of Processing, Glass Finish, and Rheology on the Interlaminar Shear Strength of a Woven e-Glass Reinforced Polymer Matrix Composite11/30/2020Technical Paper
The Compensation Problem and Solution Using Design of Experiments for Dense Multilayer Printed Circuit Boards11/30/2020Technical Paper
Standardizing a Test Method for Conductive Anodic Filament Growth Failure11/30/2020Technical Paper
Roughness Characterization for Interconnect Analysis11/30/2020Technical Paper
Re-engineered FR-4 Base Materials for Improved Multilayer PCB Performance11/30/2020Technical Paper
Process-specific PCB Thickness Modeling11/30/2020Technical Paper
Predicting Dimensional Deformation During Lamination for Multilayer Printed Circuit Boards11/30/2020Technical Paper
PCB Substrate Characterization at Multigigahertz Frequencies Through SIW Measurements11/30/2020Technical Paper
New Low Dielectric Constant, High Tg, Printed Circuitry Substrates11/30/2020Technical Paper
Moisture Absorption Properties of Laminates Used in Chip Packaging Applications11/30/2020Technical Paper

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