Aluminum Nitride (AlN) has excellent electrical insulation and high thermal conductivity, is thus considered as high performance electronic packaging material. UNIPRETEC offers a series of substrates based on AlN materials for use in various application environments.
When it comes to providing good thermal conductivity and high electrical insulation features, aluminum nitride substrate is a superb option because of its efficacy. Aluminum nitride sheets are widely used in the semiconductor application industry instead of beryllium oxide (BeO) since aluminium nitride is non-toxic and does not produce dangerous vapors when grinded and machined. Aluminum nitride ceramic substrate has a thermal expansion and isolation coefficient which closely matches the silicon wafer product, making it useful in applications in electronics that often have high temperatures and heat dissipation problems.
√ Small Dielectric Constant√ Good Mechanical Strength √ High Thermal Conductivity√ Good Smoothness / Flatness √ Excellent in Electrical Insulation√ Excellent in Thermal Shock Resistance √ Thermal Expansion Coefficient Similar to Silicon√ Excellent Resistance against Oil, Acid and Alkali
∆ The data is offered for reference only, exact data will vary depending on producing method and part configuration.
∆ Customized dimensions are available. Laser cutting service can be provided and make customized shapes and holes.
All substrates are grinded with surface roughness Ra0.3-0.6. We can also do surface polishing, one-side polishing or double-side polishing with surface roughness Ra0.02-0.05.
● LED Packages● Power Modules ● Wafer Bonding● Heat Dissipation Substrate ● Substrate for Chip Resistors● HIC Substrate/Plate for Heat Dissipation ● FAX Substrates for Thermal Printer Head● ...More
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