High frequency low loss PCB material Low loss high speed PCB materials R-5775, R-5785, R-5795, TU-872 SLK , TU-872 SLK SP, TU 933+, I-Tera MT40, Astra MT77, Tachyon 100G material EM-888, EM-888(S), EM-888(K), EM-526, EM-528, EM-528K, IT-968, IT-968 SE, IT-988G, IT-988G SE material High-Density Interconnect, or HDI PCB, are using microvias , via in pads and smaller trace/space to provide a higher signal density and superior signal integrity
High Density Interconnect (HDI) technology represents a cutting-edge evolution in printed circuit board manufacturing, leveraging microvias to pack far more components into a given footprint compared to conventional PCB architectures. Our HDI PCBs slash overall board dimensions by 30–50% while boosting signal integrity—a game-changing advantage for compact electronic systems such as 5G communication modules and precision medical instruments.
Our HDI microvia capabilities cover blind, buried, and staggered microvias—the latter being the most sophisticated option for intricate HDI layouts. Standard microvias in our PCBs feature a diameter of 0.1mm or smaller, while staggered microvias are offset across successive layers. This stacking method maximizes interconnect density without sacrificing the structural robustness of the board. Every microvia-equipped PCB we produce adheres strictly to IPC-6012 and IPC-2226 standards, guaranteeing long-term reliability in demanding applications.
We provide multilayer HDI PCB solutions spanning from 4-layer to 100-layer configurations, with the 2N2 HDI PCB emerging as our best-selling entry-level choice. Characterized by its 2-core, 2-prepreg structure, this board supports 2/2mil line width and spacing, paired with 0.1mm microvias. It strikes the perfect balance between performance and cost-effectiveness, making it suitable for consumer electronics and industrial control systems alike. All our multilayer HDI PCBs utilize high-Tg FR-4 or Rogers materials to enhance thermal stability and withstand extreme operating temperatures.
Our anylayer HDI PCB—also referred to as any layer HDI technology—is a high-end offering that enables direct connections between any two layers via laser-drilled microvias. This eliminates the need for buried vias in most scenarios, pushing component density 50% higher than traditional HDI alternatives. With tight impedance control of ±3%, this technology is tailored for high-frequency applications such as radar systems and satellite communication equipment.
Our HDI rigid-flex PCBs integrate high-density interconnect technology with flexible circuit substrates, merging the structural stability of rigid HDI boards with the bendable versatility of flexible PCBs. Microvias are seamlessly incorporated into both rigid and flexible sections, and the boards achieve a minimum bending radius of 0.5 times the board thickness. This makes them ideal for use in automotive ADAS sensors and implantable medical devices where space and flexibility are critical.
Our HDI PCB production process adheres to rigorous IPC standards and consists of 5 core stages:
Our production lines cater to both prototype orders (1–100 units) and large-scale mass production (100,000+ units), with lead times ranging from 7 to 15 days.
Our HDI design engineering team offers free Design for Manufacturing (DFM) consulting services for all HDI PCB projects. Key design guidelines we recommend include:
We also provide standardized HDI board design templates, which can cut design revision cycles by up to 30%.
As a professional HDI PCB manufacturer and supplier, we hold a suite of industry-leading certifications, including IPC-A-600, IPC-610, and ISO 13485 (for medical device applications). Our production facilities are also compliant with IATF 16949 automotive industry standards. We maintain full traceability across the entire production chain, from raw material procurement (Rogers/FR-4 substrates) to final product delivery. Our engineering team boasts over 10 years of specialized experience in HDI technology, focusing on high-reliability sectors such as aerospace, medical, and automotive.
The cost of HDI PCBs is determined by four primary factors:
We commit to transparent, all-inclusive quoting with no hidden fees for all HDI PCB projects.
We partnered with a leading 5G base station manufacturer to deliver custom anylayer HDI PCBs, incorporating staggered microvias and Rogers 4350B high-frequency material to achieve ±3% impedance control. The resulting multilayer HDI PCBs reduced the base station module size by 40% and enhanced signal integrity across the 24–40GHz frequency band. We successfully delivered over 100,000 units with zero quality defects, meeting the client’s strict deployment timelines.
Our HDI rigid-flex PCBs were integrated into a portable diagnostic device, with flexible sections enabling seamless bending and rigid sections providing a stable platform for component mounting. The microvia design optimized power efficiency, achieving a standby power consumption of ≤10mW. The product fully complied with FDA 21 CFR Part 820 regulations, helping our client accelerate time-to-market by 2 months.
An HDI board requires smaller vias to make layer transitions, particularly in fine-pitch BGA components and more traces per sq. mm. In order to accommodate fine-pitch components, you’ll find the following typical features in an HDI layout:
To prevent getting it wrong from the start, we have put together our design guidelines, to use as a checklist. The file lists some of the fabrication features that are typically associated with HDI. The feature limits listed are not comprehensive; Our experienced engineers have also worked with every type of PCB material, so they have the knowledge and expertise to provide recommendations and answer all of your HDI PCB questions. Most importantly, they kn
