The DiMaggio Technical Products Group partners with a major, offshore, PCB manufacturer employing over 850 people with revenue exceeding $102 Million from 4, capability focused factories covering all areas of PCB technology.
Layers: 10 layers
Max aspect ratio: 9:1
Min blind slot: 20*20mm
Min blind hole: 0.8mm
Min via hole: 0.8mm
Surface finishing: Immersion tin + OSP Phase difference: 2 degree
Range difference: +/-0.5 degree
Max layers: 10 layers
Max board thickness: 4.0mm
Max size: 580*600mm
Max aspect ratio: 10:1
Min blind hole: 0.2mm
Copper thickness: 6OZ
Special technical: Countersunk hole
Mix Laminating: Aluminum Matrix +FR4
Max layers: 24 layers
Max board thickness: 5.0mm
Min hole size: 0.4mm
Max size: 110*60mm
Min circuit gap/width: 4/4mil
Surface finishing: Immersion gold
Max thickness: 4.0mm
Max layers: 28 layers
Max aspect ratio: 14:1
Min via hole: 0.2mm
Min circuit gap/width: 3/3mil
Surface finishing: Immersion gold + Flash Gold Impedance control:+/-10%
Max layers: 12 layers
Max size: 850*310mm
Min via hole: 0.15mm
Surface finishing: Immersion gold Impedance control: +/-10%
Layers: 6 layers
Thickness: 4.0mm
Size: 110*530mm
Max aspect ratio: 6:1
Electromagnetic shielding: 2L
Aluminum foil shielding: 2L
Min via hole: 0.25mm
Impedance control: +/-10%
Layers: 12 layers
hickness: 1.8mm
Size: 50*180mm
Max aspect ratio: 12:1
Circuit gap/width: 3/3mil
Min BGA: 6.4mil
