Helen Frankenthaler PCB Circuit Board R&D Center

Ceramic Thin PCB for Consumer Electronics

Compact Power, Cooler Systems: The Case for Ceramic PCBs in Modern Electronics

Compact Power, Cooler Systems: The Case for Ceramic PCBs in Modern Electronics

4 Ash Street Extension, Derry, NH 03038

1.855.742.2634

pcb@frankenthalerfoundation.org

Education

Explore our Education section for valuable insights, resources, and expert guidance on manufacturing solutions. Stay informed with industry trends, best practices, and innovations to optimize your operations and success.

Blog

  • Understanding Flexible Printed Circuit (FPC) Cost Drivers
  • Malaysia: A Thriving Hub for Electronic Manufacturing
  • Optimizing Wire Harness Design for Resilience in Harsh Environments
  • Alternatives to Copper in Flexible Circuits
  • Auxiliary Materials in Flex PCB Builds
  • Flex PCB Adhesives and Bonding Guide

See All Blogs

  • Case Studies
  • Research and Academia
  • White Papers
  • eBooks
  • Videos

Our Mission

The PICA team is laser focused on helping you bring your ideas from design to delivery with engineer-driven solutions, impeccable service, and a dependable supply chain network.

Let us help you bring your idea to market. Pick A Partner - Not Parts

  • Leadership Team
  • The Pica Way
  • Our Story
  • Locations
  • Careers

About Us

  • Our Story
  • Locations
  • Careers

Products/Technologies

Core
  • Flexible Circuit Boards / Flex PCB
  • Rigid Flex Circuit Boards / Rigid Flex PCB
  • Printed Circuit Boards (PCBs)
  • Metal Core Printed Circuit Boards
  • Flat Flexible Cables
Secondary
  • FPCBA & PCBA Assembly
  • Wire Harnesses
  • Hybrid Technologies (Combining Technologies)
  • Membrane Switches
Third
  • Ceramic Printed Circuit Boards (PCB)
  • Injection Molding
  • Overmolding
  • Precision Machining
  • Box Build Assembly & Turnkey Solutions

Expertise

Col One
  • Dynamic Flex
  • Extra-long Flex Printed Circuits (FPC)
  • Ultra-Thin Flexible Printed Circuits
  • R2R (Reel to Reel Processing)
Col Two
  • Fineline PCB (High Density Interconnect)
  • Blind and Buried Microvias
  • Integrate Circuit Substrate Carrier
  • Thermal Management
Col Three
  • EMI Shielding
  • Heavy Copper
  • Impedance Control
  • X-Ray Inspection On-Site Service

Markets

  • Medical Market
  • Wearables Market
  • Payment & Identity Market
  • Communications Market
  • Automotive Market
  • Defense & Security Market
  • Industrial Electronics Market
  • Biosensor Market

Education

  • Blogs
  • Case Studies
  • White Papers
  • Videos
  • eBooks

Resources

  • PICA Company Overview Booklet
  • Capabilities
  • Trade Shows and Events
  • Credentials
  • Glossary
  • PICA’s FAQ
  • PICAKit