Helen Frankenthaler PCB Circuit Board R&D Center

Teflon Thick Copper PCB for Automotive Electronics

Copper Core PCB | Copper Metal Core PCB

Copper Core PCB with 3 OZ copper thickness

Layers : Single Layer

PCB Material: Copper core

Board Thickness: 3.0mm

Surface Finishing: OSP

Finished Copper thickness: 3 OZ

Solder mask: White Color

Special Technology:

Thermal Conductivtiy 3W/mk

Copper thickness 3oz

PCB board thickness 3.0mm

Our Service:

Quickturn around PCB prototype manufacturing

PCB fabricate and PCB assembly service

Stencil service

Minimum Circuit Trace Width/Space: 2.7/2.7mil

The Minimum Via Size : 0.15mm

The Minimum legend Height/Width: 0.5mm/0.12mm

Surface Finishing: HASL-LF, ENIG,ENEPIG,OSP,Gold Finger,Hard Gold Plating,Immersion Silver,Immersion Tin

Special Technology: Blind&buried via, Via In Pad,Backdrill,Small BGA Pad,Impedance control,Heavy Copper,Copper Filled Vias,Countersink hole,Depth Milling

Material Type: FR4,Metal Core,Halogen Free FR4,Rogers,PTFE,Arlon,Nelco,Polyimide

Final Board Thickness: 0.4mm ~ 6.0mm

Final Copper Thickness: HOZ 1OZ 2OZ 3OZ 4OZ 6OZ 10OZ

FR4 Substrate Thickness: 0.1mm 0.2mm 0.3mm 0.4mm 0.5mm 0.6mm 0.8mm 1.0mm 1.2mm 1.5mm 2.0mm 2.36mm

Shaping: CNC Routing,Punching,V-CUT, Depth milling, Castellation

Special Hole: Blind&buried hole,Depth milling,T-slot,Countersink hole

Quick-turn Lead Time: 1 Day for 2 Layer PCB, 2 Days for 4 Layer PCB, 3 Days for 6 Layer PCB

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Product

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  • Rigid Flex PCB
  • MCPCB
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  • PCB Assembly

Specials

  • Backdrill PCB Technology
  • Embedded Copper Coin PCB Technology
  • PCB Depth Slot Technology
  • Countersink Hole
  • Via in Pad(VIP)
  • Blind And Buried Vias Technology

Contact Us

Hengmingzhu Industrial Park, Tongfuyu Industrial Zone, Shajing Street, Bao’an District, Shenzhen, China

+86 755 23062369

pcb@frankenthalerfoundation.org

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