Helen Frankenthaler PCB Circuit Board R&D Center

High Frequency Thin PCB for Energy Storage

I-Speed Laminate and Prepreg PCB materials | Isola Group

high speed pcb electronics factory

Thermal Performance

Tg: 180°C

Td: 360°C

Electrical Performance

Dk: 3.63

Df: 0.0060

Industry Approvals

IPC-4101 /98/99/101/126

UL - File Number E41625

I-Speed® laminate and prepreg products are manufactured with Isolas’ patentable high performance multi-functional resin system, reinforced with electrical grade(E-glass) glass fabric. This system delivers a 15% improvement in Z-axis expansion and offers 25% more electrical bandwidth (lower loss) than competitive products in this space. These properties coupled with superior moisture resistance at reflow, result in a product that bridges the gap from both a thermal and electrical perspective.

The I-Speed®resin system is laser fluorescing and UV blocking for maximum compatibility with Automated Optical Inspection (AOI) systems, optical positioning systems and photo imagable solder mask imaging.

Product Summary

Product Features

  • Industry Recognition
    • UL File Number: E41625
    • Qualified to UL’s MCIL Program
    • RoHS Compliant
  • Performance Attributes
    • Lead-free assembly compatible
  • Processing Advantages
    • FR-4 process compatible
    • UV blocking and AOI fluorescence
    • Multiple lamination cycles
    • HDI technology compatible

Production & Manufacturing

Currently manufactured in Asia, North America

Product Availability

  • Standard Material Offering: Laminate
    • 2 to 28 mil (0.05 to 0.71 mm)
  • Copper Foil Type
    • HTE Grade 3
    • HVLP (VLP2) ≤2.5 micron Rz JIS
    • RTF (Reverse Treat Foil)
    • Embedded resistor foil
  • Copper Weight
    • ½, 1 and 2 oz (18, 35 and 70 µm) available
    • Heavier copper foil available
    • Thinner copper foil available
  • Standard Material Offering: Prepreg
    • Tooling of prepreg panels
    • Moisture barrier packaging
  • Glass Fabric Availability
    • E-glass
    • Square weave glass
    • Mechanically spread glass

Typical Values

PropertyTypical ValueUnitsTest Method
Metric (English)IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC180°C2.4.25C
Glass Transition Temperature (Tg) by DMA195°C2.4.24.4
Decomposition Temperature (Td) by TGA @ 5% weight loss360°C2.4.24.6
Time to Delaminate by TMA (Copper removed)A. T260 B. T288>60Minutes
Z-Axis CTEA. Pre-Tg B. Post-Tg C. 50 to 260°C, (Total Expansion)45 230 2.5ppm/°C ppm/°C %
X/Y-Axis CTEPre-Tg16ppm/°C
Thermal Conductivity0.4W/m·KASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)A. Unetched B. EtchedPassPass Visual
Dk, PermittivityA. @ 1 GHz B. @ 2 GHz C. @ 5 GHz D. @ 10 GHz3.65 3.64 3.63 3.63—
Df, Loss TangentA. @ 1 GHz B. @ 2 GHz C. @ 5 GHz D. @ 10 GHz0.0057 0.0059 0.0059 0.0060—
Volume ResistivityA. After moisture resistance B. At elevated temperature4.4 x 10 7 9.4 x 10 7MΩ-cm
Surface ResistivityA. After moisture resistance B. At elevated temperature2.6 x 10 6 2.1 x 10 8MΩ
Dielectric Breakdown>50kV2.5.6B
Arc Resistance137Seconds2.5.1B
Electric Strength (Laminate & laminated prepreg)70 (1741)kV/mm (V/mil)2.5.6.2A
Comparative Tracking Index (CTI)2 (250-399)Class (Volts)UL 746A ASTM D3638
Peel StrengthA. Standard profile copper 1. After thermal stress 2. After thermal stress 3. After process solutions1.14 (6.5) 0.96 (5.5) 0.90 (5.1)N/mm (lb/inch)
Flexural StrengthA. Length direction B. Cross direction462 (67.0) 427 (62.0)MPa (kpsi)
Tensile StrengthA. Length direction B. Cross direction330 (48.3) 254 (35.6)MPa (kpsi)
Young's ModulusA. Length direction B. Cross direction2868 2730ksi
Poisson's RatioA. Length direction B. Cross direction0.173 0.152—
Moisture Absorption0.061%2.6.2.1A
Flammability (Laminate & laminated prepreg)V-0RatingUL 94
Relative Thermal Index (RTI)130°C—
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.

NOTE

Revisions:

A: Initial release - 4/17

B: Corrected units for Flexural and Tensile Strength - 8/18

C: Removed Low Dk glass option - 10/18

D: Change MOT to RTI - 5/19

E: Revised CTI to 2 - 1/21

F: Changed VLP2 to HVLP to align with common industry terms 4/21

G: Corrected data sheet Df values to align with Construction table values 12/22

H: Added construction option to 28 mils and added DMA Tg- 3/24

I: Modified alpha 1 CTE from 60 to 45 ppm/C and overall from 50-260C from 2.7% to 2.5% (6x2116 30 mil data) 8/24

Constructions

Core Data
ConstructionResin Content %Thickness (inch)Thickness (mm)Dielectric Constant (DK)/ Dissipation Factor (DF)
2 GHz5 GHz10 GHz15 GHz20 GHz
1x106766.00%0.00200.0513.57 0.0059
1x106772.00%0.00250.0643.45 0.0058
1x108066.00%0.00300.0763.57 0.0059
1x107869.50%0.00350.0893.50 0.0058
1x331352.00%0.00350.0893.89 0.0060
2x106766.00%0.00400.1023.57 0.0059
1x331357.00%0.00400.1023.77 0.0060
1x211656.50%0.00500.1273.79 0.0060
2x106772.00%0.00500.1273.45 0.0058
2x108066.00%0.00600.1523.57 0.0059
2x331357.00%0.00800.2033.77 0.0060
2x211656.50%0.01000.2543.79 0.0060
3x331357.00%0.01200.3053.77 0.0060
3x211656.50%0.01500.3813.79 0.0060
4x211656.50%0.02000.5083.79 0.0060
1x3313/4x211656.60%0.02400.6103.79 0.0060
2x3313/4x211656.60%0.02800.7113.79 0.0060
Prepreg Data
Glass StyleResin content %Thickness (inch)Thickness (mm)Dielectric Constant (DK)/ Dissipation Factor (DF)
2 GHz5 GHz10 GHz15 GHz20 GHz
106766.00%0.00200.0513.57 0.0059
106770.00%0.00230.0583.49 0.0058
103571.50%0.00240.0613.46 0.0058
106774.00%0.00270.0693.41 0.0058
106776.50%0.00310.0793.36 0.0058
108066.00%0.00310.0793.57 0.0059
108664.00%0.00330.0843.62 0.0059
108069.00%0.00340.0863.51 0.0059
107869.50%0.00360.0913.50 0.0058
108670.00%0.00400.1023.49 0.0058
331357.00%0.00400.1023.78 0.0060
107873.50%0.00420.1073.42 0.0058
331359.00%0.00430.1093.73 0.0060
211656.50%0.00510.1303.79 0.0060
211659.00%0.00550.1403.73 0.0060

NOTE

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