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PCB Prototype – Yunlike Intelligent
PCB Prototype – Yunlike Intelligent
Standard PCB Capabilities
Item
Capabilities
Layer Count
1 – 32 Layers
Max Board Dimension
24*24″ (610*610mm)
Min Board Thickness
0.15mm
Max Board Thickness
6.0mm – 8.0mm
Copper Thickness
Outer Layer:1oz~30oz, Inner Layer:0.5oz~30oz
Min Line Width/Line Space
Normal: 4/4mil (0.10mm); HDI: 3/3mil (0.076mm)
Min Hole Diameter
Normal: 8mil (0.20mm) ; HDI: 4mil (0.10mm)
Min Punch Hole Dia
0.1″ (2.5mm)
Min Hole Spacing
12 mil (0.3mm)
Min PAD Ring(Single)
3mil (0.075mm)
PTH Wall Thickness
Normal: 0.59mil (15um); HDI: 0.48mil (12um)
Min Solder PAD Dia
Normal: 14mil (0.35mm); HDI: 10mil(0.25mm)
Min Soldermask Bridge
Normal: 8mil (0.2mm); HDI: 6mil (0.15mm)
Min BAG PAD Margin
5mil (0.125mm)
PTH/NPTH Dia Tolerance
PTH: ± 3mil (0.075mm) ; NPTH: ±2 mil (0.05mm)
Hole Position Deviation
±2 mil (0.05mm)
Outline Tolerance
CNC: ± 6mil (0.15mm); Die Punch: ± 4mil (0.1mm); Precision Die: ± 2mil (0.05mm)
Impedance Controlled
Value>50ohm: ±10%; Value≤50ohm: ±5 ohm
Max Aspect Ratio
8:1
Surface Treatment
ENIG, Flash Gold, Hard Gold Finger, Gold Plating(50mil), Gold finger, Selected Gold plating,ENEPIG, ENIPIG; HAL, HASL(LF), OSP, Silver Imm., Tin Imm
Soldermask Color
Green/White/Black/Yellow/Blue/Red
Large Format PCB Capabilities
Item
Capabilities
Layer Count
1 – 10 Layers
Max Board Dimension
24*64″(610*1625mm)
Min Board Thickness
0.6mm
Max Board Thickness
4.0mm
Conductor Thickness
0.5oz – 10oz
Min Line Width/Line Space
4/4mil (0.10/0.10mm)
Min Hole Diameter
10mil (0.25mm)
Min Punch Hole Dia
0.12″ (3.0mm)
Min Hole Spacing
16mil (0.4mm)
Min PAD Ring(Single)
3mil (0.075mm)
PTH Wall Thickness
Normal: 0.59mil (15um); HDI: 0.48mil (12um)
Min Solder PAD Dia
14mil (0.35mm)
Min Soldermask Bridge
8mil (0.20mm)
Min BAG PAD Margin
5mil (0.125mm)
PTH/NPTH Dia Tolerance
PTH: ±3 mil (0.075mm); NPTH: ±2mil (0.05mm)
Hole Position Deviation
±3mil (0.075mm)
Outline Tolerance
CNC: ±6 mil (0.15mm); Die Punch: ±6 mil (0.1mm)
Max Aspect Ratio
10:1
Surface Treatment
ENIG, Flash Gold, Hard Gold Finger, Gold Plating(50mil), Gold finger, Selected Gold Plating, ENEPIG, ENIPIG, HAL, HASL(LF), OSP, Silver Imm., Tin Imm
Ceramic PCB Capabilities
Item
Thick Film Capabilities
DCB/DBC Capabilities
DPC Capabilities
AMB Capabilities
Layer Count
10 Layers
2 Layers
2 Layers
2 Layers
Max Board Dimension
138*190mm
138*178mm
138*190mm
114*114mm
Min Board Thickness
0.25mm
0.30mm – 0.40mm
0.25mm
0.25mm
Max Board Thickness
2.0mm
1L: 1.3mm; 2L 1.6mm
2.0mm
1.8mm
Conductor Thickness
5um – 13um
0.10mm – 0.30mm
2um – 200um
0.25mm – 0.80mm
Min Line Width/Line Space
6/8mil (0.15/0.20mm)
12/12mil (0.30/0.30mm)
6/8mil (0.15/0.20mm)
20/20mil (0.50/0.50mm)
Substrate Type
Al2O3, AIN, BeO, ZrO2
Al2O3, AIN, ZrO2
Al2O3, AIN, ZrO2, Si3N4
Al2O3, AIN, Si3N4
Substrate Thickness
0.25, 0.38, 0.50, 0.635, 0.80, 1.0, 1.5, 2.0mm
0.25, 0.38, 0.50, 0.635, 0.76, 1.0, 1.5, 2.0mm
0.25, 0.38, 0.50, 0.635, 0.80, 1.0, 1.5, 2.0mm
0.25, 0.38, 0.50, 0.635, 0.76, 1.0mm
Min Hole Diameter
4mil (0.1mm)
Min Hole Spacing
NPTH: 16mil (0.30mm); PTH: 20mil (0.5mm)
Min PAD Ring(Single)
6mil (0.15mm)
N/A
3mil (0.075mm)
N/A
PTH Wall Thickness
4mil (10um)
N/A
4mil (10um)
N/A
Min Solder PAD Dia
10mil (0.25mm)
8mil (0.20mm)
6mil (0.15mm)
8mil (0.20mm)
Min Soldermask Bridge
12mil (0.30mm)
8mil (0.20mm)
6mil (0.15mm)
8mil (0.20mm)
Min BGA PAD Margin
12mil (0.30mm)
8mil (0.20mm)
5mil (0.125mm)
8mil (0.20mm)
PTH/NPTH Dia Tolerance
PTH: ±4mil (0.1mm) ; NPTH: ±2mil (0.05mm)
Hole Position Deviation
± 4mil (0.1mm)
Outline Tolerance
Laser: +0.20/-0.05mm
Line Width/Spac Tolerance
± 5mil (0.125mm)
± 5mil (0.125mm)
± 1mil (0.025mm)
± 5mil (0.125mm)
Surface Treatment
AgPd, AgPt, Au
OSP/Ni Plating/ENIG/ENEPIG
Thermal Stress
1 hour @ 350℃
3 x 10 Sec @ 280 ℃
15 min @ 350 ℃
3 x 10 Sec @ 280 ℃
Flexible PCB Capabilities
Item
Capabilities
Layer Count
1 – 30 Layers
Max Board Dimension
1L:500*2000mm; 2L:250*1380mm
Min Board Thickness
0.05mm
Max Board Thickness
3.0mm
Conductor Thickness
1/3 OZ(12 um) – 4OZ(140um)
Min Line Width/Line Space
2/2mil (0.05/0.05mm)
Min Hole Diameter
4mil (0.10mm)
Min Hole Spacing
NPTH:16mil (0.4mm); PTH:20mil(0.5mm)
Min PAD Ring(Single)
3mil (0.075mm)
PTH Wall Thickness
0.59mil (15um)
Min Solder PAD Dia
10mil (0.25mm)
Min Soldermask Bridge
12mil (0.30mm)
Min BAG PAD Margin
12mil (0.30mm)
PTH/NPTH Dia Tolerance
PTH: ±3mil (0.075mm); NPTH: ±2mil (0.05mm)
Hole Position Deviation
±4mil (0.10mm)
Outline Tolerance
Laser: +0.15mm / -0.05mm; Die Punch: +0.10 / -0.20 mm
Max Aspect Ratio
8:1
Surface Treatment
ENIG, Flash Gold, Hard Gold Finger, Gold Plating(50mil), Gold Finger, Selected Gold Plating, ENEPIG, ENIPIG
Impedance Controlled
Value>50ohm: ±10%; Value≤50ohm: ±5 ohm
Rigid-Flex PCB Capabilities
Item
Capabilities
Layer Count
2 – 50 Layers
Max Board Dimension
500*500mm
Min Board Thickness
0.30mm
Max Board Thickness
4.0mm
Conductor Thickness
0.5oz(18 um) – 2oz(70um)
Min Line Width/Line Space
3/3mil (0.075/0.075mm)
Min Hole Diameter
4mil (0.10mm)
Min Hole Spacing
NPTH:16mil (0.4mm); PTH:20mil(0.5mm)
Min PAD Ring(Single)
3mil (0.075mm)
PTH Wall Thickness
0.59mil (15um)
Min Solder PAD Dia
10mil (0.25mm)
Min Soldermask Bridge
12mil (0.30mm)
Min BAG PAD Margin
12mil (0.30mm)
PTH/NPTH Dia Tolerance
PTH: ±3mil (0.075mm); NPTH: ±2mil (0.05mm)
Hole Position Deviation
±4mil (0.10mm)
Outline Tolerance
Laser: +0.15mm / -0.05mm; Die Punch: +0.10 / -0.20 mm
Max Aspect Ratio
8:1
Surface Treatment
ENIG, Flash Gold, Hard Gold Finger, Gold Plating(50mil), Gold Finger, Selected Gold Plating, ENEPIG, ENIPIG
Impedance Controlled
Value>50ohm: ±10%; Value≤50ohm: ±5 ohm
