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Layer :2
Board thickness: 1.6 mm
Material: FR4 TG170
Out layer copper thickness: 1 oz
Inner layer copper thickness:1 oz
Surface treatment: Immersion gold 2U”
Application: Consumer electronics
Minimum through hole: 0.3 mm
Minimum line width/line spacing: 3.5 mil/ 3.8 mil
Layer :4
Board thickness: 2.0mm
Material: ITEQ TG180
Out layer copper thickness: 2 oz
Inner layer copper thickness:3oz
Surface treatment: Immersion Silver
Application: Industrial control
Minimum through hole: 0.35 mm
Minimum line width/line spacing: 3.2 mil/ 3.6 mil
Layer :6
Board thickness: 2.6mm
Material: SY TG150
Out layer copper thickness: 3 oz
Inner layer copper thickness:3 oz
Surface treatment: Plugging with Resin
Application: Digital communication
Minimum through hole: 0.25 mm
Minimum line width/line spacing: 5.1 mil/ 6.2 mil
Layer :12
Board thickness: 2.8mm
Material: Rogers
Out layer copper thickness: 5 oz
Minimum BGA: 0.3mm
Minimum through hole: 0.2 mm
Minimum line width/line spacing: 4.1 mil/ 3.6 mil
Layer :14
Board thickness: 4.7 mm
Material: Nelco
Out layer copper thickness: 6 oz
Inner layer copper thickness: 5 oz
Surface treatment: Plated silver 10-20μm Ag
Application: Automotive electronics
Minimum BGA: 0.25 mm
Minimum through hole: 0.3mm
Minimum line width/line spacing: 4.2 mil/ 5.3 mil
Layer :28
Board thickness: 6 mm
Material: Halogenfree FR4
Out layer copper thickness: 3oz
Inner layer copper thickness: 2 oz
Surface treatment: ENEPIG
Minimum through hole: 0.35mm
Minimum line width/line spacing: 4.1mil/ 5.2 mil
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