Helen Frankenthaler PCB Circuit Board R&D Center

Low Loss Long PCB for Energy Storage

HDI PCB Capabilities - MyRO PCB

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HDI PCB Capabilities

Dimensions

610 mm * 710 mm Max.

50 mm * 50 mm Min.

Materials

FR4/CEM-1/Aluminium/PFTE/Rogers

Board Thickness

0.3-2.4 mm, 3.2mm prototypes available

Inner Layers

Trace / Space

Etch compensation for inner layer cores (applicable to wet film cores only)

Compensation widths (um)Gaps after compensation (um)Annular ring after compensation (um)Artwork gaps before compensation (um)Artwork trace widths before compensation (um)
Base copper weight Individual traces Normal Min.Normal Min.Normal Local Min.Normal Min.Normal Min.0.33 / H OZ 36 26 16 70 56 150 90 89 76 89 761.5 OZ 50 45 35 80 80 180 120 125 115 106 802 OZ 70 60 50 100 100 250 150 160 150 150 1202.5 OZ 110 90 80 110 110 280 230 200 190 165 135
3 OZ140 120 100 120 120 300 250 240 220 180 1504 OZ 190 140 120 150 130 400 350 310 250 250 2005 OZ 230 200 180 180 150 450 380 380 330 250 2006 OZ 280 250 220 250 200 530 470 500 420 280 250
Annular Ring

Refer to the above table

Prepregs with DK 4.2-4.6
  • 1080: 3-3.35 mils in thickness
  • 2116: 4.53-5.12 mils in thickness
  • 7628: 7.56-8.46 mils in thickness
  • 2113: 4 mils in thickness
  • 106: 2-2.36 mils in thickness
  • 1506 (not recommended): 6.3 mils in thickness
  • 7630 (not recommended): 8 mils in thickness

Drill

Dimensions

Max.: 690 mm * 885 mm

Max. Panel Dimensions: 620 mm * 725 mm

Min. Drill Size

0.2 mm

Max. Drill Size

6.35 mm

Min. Diameter-to-Thickness Ratio

1 : 12

Drilling Compensation

Finished diameter: D; Tolerance Upper Limit: L; Min. Wall Thickness (Single point): H

Board Thickness(mm)Surface Finish Compensation Calculator (L ≤ 0.076mm, L = 0.076mm if the upper limit is larger than 0.076mm)Non Crimp PTHsCrimp PTHs
< 1.0HASLD+L+(H+0.005)*2+0.01D+L+H*2
Non-HASLD+L+(H+0.005)*2D+L+H*2
1.0 ≤ x < 5.0HASLD+L+(H+0.005)*2+0.01D+L+H*2+0.01
Non-HASLD+L+(H+0.005)*2D+L+H*2
≥ 5.0HASLD+L+(H+0.005)*2+0.02D+L+H*2+0.02
Non-HASLD+L+(H+0.005)*2+0.01D+L+H*2+0.01

Outer Layers

Etching …2nd Outer-most / Outer Layer Compensation
Artwork gaps before compensation (um)Max. copper thickness (um)Design copper thickness (um)Min. artwork trace width X (um) before Compensation Artwork trace width X / Gap Y before Compensation (um)Trace width compensation Min. gap after compensation (um)Min. trace width after compensation (um)PAD compensation (um)Impedance trace compensation A/R (um) Trace-to-trace compensation (um)Gap Y1 after primary compensation (um)Dynamic compensation (um)
50 ≤ x < 602520+/-440 100 ≤ X+Y1045<Y1≤ 55 55<Y1≤ 65 65<Y1≤75 75<Y1≤85 Y1>855 9 12 14 1940 60 50 25 um as compensation width should be priorly applied For plated through holes,
60 ≤ x <703025+/-450 120 ≤ X+Y1055<Y1≤ 65 65<Y1≤75 75<Y1≤85 85<Y1≤ 95 Y1>956 10 13 16 2050 70 55 30 um as compensation width should be priorly applied35 30+/-4125 ≤ X+Y 65<Y1≤75 75<Y1≤85 85<Y1≤ 95 Y1>95 6 12 16 20 55 75
70 ≤ x <803530+/-460 140 ≤ X+Y65<Y1≤75 75<Y1≤85 85<Y1≤ 95 95<Y1≤ 105 Y1>1056 12 14 18 2560 85 60 35 um as compensation width should be priorly applied
90 ≤ x <1004439+/-480 166 ≤ X+Y2466<Y1≤80 80<Y1≤ 95 95<Y1≤ 115 115<Y1≤ 135 Y1>1356 14 20 25 3566 110 80 43 um as compensation width should be priorly applied For plated through holes,
100 ≤ x <1254944+/-490 200 ≤ X+Y3070<Y1≤ 85 65<Y1≤100 100<Y1≤125 125<Y1≤ 145 Y1>1458 16 22 30 4070 130 90 50 um as compensation width should be priorly applied For plated through holes,
Compensation widths (um)Impedance Trace Compensation Gaps after compensation (um)Annular ring after compensation (um)Artwork gaps before compensation (um Artwork trace widths before compensation (um)Max. Copper Thickness (um)Individual traces Normal Dense Traces Normal Min.Normal Local Min.Normal Min.Normal Min.
X≤ 5980 60 45 2nd outer-most…90 80 180 100 150 125 125 100X≤ 6990 70 50 90 85 180 110 160 135 150 126X≤ 79100 80 55 100 90 180 130 180 145 175 150
X≤ 83110 90 60 105 90 200 130 190 150 190 160X≤ 89120 95 70 125 100 230 160 220 170 200 176X≤ 108130 110 95 130 110 250 180 240 205 240 205
X≤ 115150 140 120 150 120 270 200 270 230 270 230X≤ 131180 160 140 170 150 300 220 300 250 300 250X≤ 149210 180 160 200 170 300 250 330 280 330 280

A. Dynanic compensation should be applied if the sum of artwork trace width X + Gap Y before Compensation is less than 160 um.

B. For artwork with the Min. trace width, normal compensation widths should be priorly applied.

Trace / Space

Refer to the above table

Trace – to – Copper

At least 7 mils for electrolytic gold; at least 8 mils for 1 OZ copper board; at least 10 mils for 2 OZ copper board with 9 mils as the extreme.

Annular Ring

Refer to the above table

Outline

CNC copper to outline: at least 0.2 mm;V-cut: usually 0.7mm or wider for score lines, depending on V-cut depth and angle.

Pattern Plating

Max. Dimensions

200 mm * 1000 mm

Copper Thickness

1 – 6 OZ

Tin Thickness

200-400 u”

Hole Wall Thickness

For gold plating board: 15um; For HASL board: 18-25um

Plugging Paste and Dry Film Tenting Capabilities of Dry Film Tenting
ProcessBoard Thickness (mm)Max. Tenting Diameters (mm)Min. Annular Ring (Tenting Vias) @Max. Tenting Diameters (mm)Max. Slot Hole Tenting (mm)Dual Hole Tenting (mm)
Outer Layer Negative Film1.0 – 3.2Φ 5.5 (PTH)0.1755.0 * 5.5 (PTH)Unavailable
< 1.0Φ 4.0 (PTH)0.1753.5 * 4.0 (PTH)Unavailable
Outer Layer Positive Film1.0 – 3.2Φ 7.0 (NPTH)0.1756.5 * 7.0 (NPTH)5.5
<1.0Φ 5.5 (NPTH)0.1755.0 * 5.5 (NPTH)Unavailable

Notes:

  • The dry film photoresist is usually 0.2mm expanded by the hole edge. When the hole diameter is no less than 5mm, the annular ring must be 0.2 mm at least.
  • The table above is applicable to automated plugging equipment only, not applicable to vacuum plugging equipment. For flex – rigid boards, vacuum plugging equipments are needed: A. For positive film, the Max. tenting diameter is Φ 2.5 mm, the Max. slot hole is 1.0 mm * 3.0 mm; if NPTH hole > 2.5 mm, 2nd drilling is needed. B. For negative film, the Max. tenting diameter is Φ 1.2 mm, the Max. slot hole is 1.0 mm * 2.0 mm; if PTH hole > 1.2 mm, go through the positive film process.

Electrolytic

Nickel Thickness

100-200 u”

Gold Thickness

Thin gold 1-2 u”, Thick gold ≤1um (ENIG is suggested if the plated area is over 40% of the total area)

Solder Mask

Max. Dimensions

620 mm * 725 mm

Thickness

Thickness Types of CoatingSolder Mask Thickness (um) Traces (A)Trace Corners (B)Copper Pour (C)Substrate (D)
Screen Printing Finished copper thickness < 60 um10 – 255 – 2010 – 35Height over copper surface < 25 um
Finished copper thickness ≥ 60 um15 – 5010 – 4020 – 35Height over copper surface < 30 um
Low-Pressure, Electrostatic Spray Finished copper thickness < 60 um30 – 5015 – 3540 – 60Height over copper surface < 35 um
Finished copper thickness ≥ 60 umUnavailable. Linemask process supported with green / matte green solder resist if demanded.
  • For boards that require ≤20 um in solder mask thickness over traces, the finished copper thickness should be no more than 40 um. The upper limit – 25 um in solder mask thickness over traces is advised . If not accepted, a review process is needed.
  • For boards with BGA pitch ≤0.4 mm that require finished copper thickness within 40um, solder mask thickness by default is 30 um if no specific requirents are proposed. Only screen printing is available.

Solder Mask Bridge

Solder Mask Bridge PositionFinished Copper ThicknessGlossy / Matte Green Glossy / Matte Black or White Glossy / Matte with other colors Normal Extreme Normal