Low Loss Rigid PCB for Energy Storage

Rigid PCB – Topright Circuits PCB and PCB Assembly

Topright Rigid PCB Capability

Item	Manufacture Capability
Layers	1-50 Layers
HDI	5+N+5
Impedance Controlled	Min +/-5%, General+/-10%
Material Types	Fr-4, Fr-5, High-Tg, Aluminum, Copper PCB, Halogen Free, Carbon PCB
Material	Isola, Taconic, Arlon, Teflon, Rogers
Max. Panel Dimension	35000mil * 47000mil (1000mm * 1200mm)
Min. Panel Size	24mil (0.6mm)
Board Thickness	8mil-480mil (0.2 - 12mm)
Board Thickness Tolerance	±10%
Dielectric Thickness	3mil-8mil (0.075mm-0.20mm)
Min. Track Width	3mil (0.075mm)
Min. Track Space	3mil (0.075mm)
External Cu Thickness	0.5 OZ - 40 OZ (17um - 1400um)
Internal Cu Thickness	0.5OZ - 15 OZ (17um - 525um)
Drilling Size (CNC)	6mil-256mil (0.15mm - 6.50mm)
Finished Hole Dimension	4mil-236mil(0.1mm - 6.0mm)
Hole Tolerance	±2mil (±0.05mm)
Laser Drilling Hole Size	4mil(0.1mm)
Aspect Ration	16:01
Solder Mask	Green, Blue, White, Black, Red, Yellow, Purple, etc.
Solder mask Bridge	2mil(0.050mm)
Plugged Hole Diameter	8mil-20mil (0.20mm-0.50mm)
Scoring	±0.25 mm, 15°30°45°
Beveling	20-45 Deg
Surface Finishing	HASL, HASL(Lead Free), ENIG(Gold 1 U"~10 U"), Immersion Silver, Immersion Tin, OSP, Hard Gold (up to 100u")
Certification	UL RoHS ISO9001 SGS
Inspect Standard	IPC 6012B Class 2, IPC 6012B Class 3
Testing	Flying probe, E-TEST, X-RAY Inspection, AOI
Files	Gerber Protel DXP Auto CAD PADS OrCAD Express PCB etc

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