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Rogers Microwave RF PCB for Consumer Electronics

Rogers RO3003 Microwave PCB 2-Layer Rogers 3003 20mil Circuit Board DK3.0 DF 0.001 High Frequency PCB

Rogers RO3003 Microwave PCB 2-Layer Rogers 3003 20mil Circuit Board DK3.0 DF 0.001 High Frequency PCB

MOQ:1 Price:USD 2.99-9.99 PER PIECE Standard Packaging:Vacuum Delivery Period:10 working days Payment Method:T/T, Western Union Supply Capacity:45000 pieces per month

Detail Information

AttributeSpecification
Place of OriginChina
Brand NameBicheng Technologies Limited
CertificationUL
Model NumberBIC-0038-V0.75
Number Of Layers2
Glass EpoxyRO3003
Final Foil1.0 Oz
Final Height Of PCB0.6 Mm ±10%
Surface FinishImmersion Gold
Solder Mask ColorN/A
Colour Of Component LegendN/A
Test100% Electrical Test Prior Shipment
Minimum Order Quantity1
PriceUSD 2.99-9.99 PER PIECE
Packaging DetailsVacuum
Delivery Time10 working days
Payment TermsT/T, Western Union
Supply Ability45000 pieces per month

Product Description

Rogers RO3003 Microwave PCB 2-Layer Rogers 3003 20mil Circuit Board DK3.0 DF 0.001 High Frequency PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

Rogers RO3003 high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. It was designed to offer exceptional electrical and mechanical stability at competitive prices. The mechanical properties are consistent. This allows the designer to develop multi-layer board designs without encountering warpages or reliability problems. RO3003 materials exhibit a coefficient of thermal expansion(CTE) in the X and Y axis of 17 ppm/℃. This expansion coefficient is matched to that of copper, which allows the material to exhibit excellent dimensional stability, with typical etch shrinkage, after etch and bake, of less than 0.5 mils per inch. The Z-axis CTE is 24 ppm/℃, which provides exceptional plated through-hole reliability, even in severe environments.

Typical applications:
  • Automotive radar
  • Cellular telecommunications systems
  • Datalink on cable systems
  • Direct broadcast satellites
  • Global positioning satellite antennas
  • Patch antenna for wireless communications
  • Power amplifiers and antennas
  • Power backplanes
  • Remote meter readers
PCB Specifications

PCB SIZE 90 x 75mm=1PCS BOARD TYPE Double sided PCB Number of Layers 2 layers Surface Mount Components YES Through Hole Components NO

LAYER STACKUP

copper ------- 18um(0.5 oz)+plate TOP layer RO3003 0.508mm copper ------- 18um(0.5 oz) + plate BOT Layer

TECHNOLOGY

Minimum Trace and Space:5 mil / 5 mil Minimum / Maximum Holes:0.5mm Number of Different Holes:1 Number of Drill Holes:1 Number of Milled Slots:0 Number of Internal Cutouts:0 Impedance Control:no Number of Gold finger:0

BOARD MATERIAL

Glass Epoxy:RO3003 0.508mm Final foil external:1 oz Final foil internal:N/A Final height of PCB:0.6 mm ±0.1

PLATING AND COATING

Surface Finish Immersion gold (31%) Solder Mask Apply To:NO Solder Mask Color:N/A Solder Mask Type:N/A

CONTOUR/CUTTING

Routing

MARKING

Side of Component Legend Top Side Colour of Component Legend Black Manufacturer Name or Logo:Marked on the board in a conductor and legend FREE AREA