For some PCB designs, dielectric PCB properties are critical when selecting laminates and prepregs (PP). Rogers Corporation has long been industry heavyweight for advanced PCB materials in high frequencies applications. The high frequency Rogers Printed Circuit Boards (PCBs) Manufacturing relies on high frequency laminates that assure improve electrical performance when used in the applications, like
Rogers PCB
The use of advanced PCB materials not only supports the building of next generation designs but also contributes to lower dielectric loss and low electrical signal loss, among others. As a Rogers PCB Manufacturer, MADPCB has a long-term cooperation with Rogers material suppliers, which supply us high-performance dielectrics, laminates and prepregs from Rogers. With special high frequency circuit materials from Rogers, MADPCB builds Rogers PCBs with high-frequency and high-speed performance. Our range of Rogers PCBs are designed to offer greater thermal performance in severe application environments.
While, there are many restricts when sourcing, some materials are hard to buy. Each procurement should report the information of customer’s company name, address and nationality, product application and purpose, and etc.
Rogers Corporation is headquartered in Chandler, Arizona with manufacturing plants in the United States, China, Germany, Belgium, Hungary and South Korea, its joint ventures and sales offices are located all over the world. The business segment related to High Frequency, or Radio Frequency (RF) Printed Circuit Boards is Advanced Connectivity Solution (ACS).
From 2003, with the foundation of its first facility -Rogers Technologies (Suzhou) Co., Ltd., Rogers starts to process high-frequency PCB copper clad laminate (CCL) materials in China for use in communication applications.
Rogers’ Advanced Connectivity Solutions (ACS) business provides leading advanced circuit material solutions. ACS manufactures high frequency laminates, bondplys and prepregs, engineered to meet stringent performance requirements. With exceptional dielectric constant control, Rogers’ specialty materials are a consistent and reliable choice for applications including 5G wireless communication, automotive radar sensors, aerospace, satellites and more. ACS Rogers PCB materials include:
92ML materials are halogen-free, flame retardant, ceramic-filled thermally conductive multi-functional epoxy prepreg and laminate systems. They provide a low-cost, lead-free solder compatible system with enhanced heat transfer characteristics for multilayer PCBs for applications requiring thermal management throughout the entire board volume. 92ML materials are engineered for use with metal backing for producing aluminum metal core PCBs.
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Rogers AD Series PTFE/woven glass based laminates are designed to deliver the consistent, high performance required of high frequency PCB materials for cost sensitive commercial applications.
Rogers CLTE Series materials offer tight dielectric constant and thickness tolerance, low loss tangent, low out-gassing and low insertion loss. The ceramic, PTFE woven-glass composite material has higher thermal conductivity than conventional PCB dielectrics and is ideal for thin multilayer boards, providing the option of the highest degree of embedded resistor consistency in the industry.
Rogers CuClad laminates are woven fiberglass reinforced PTFE based composites for use as PCB substrates and radomes in high frequency applications. CuClad laminates feature low dielectric constants (Dk) ranging from 2.17 to 2.60, low electrical loss of tan δ from 0.0009 to 0.0018 at X-band and low moisture absorption. These balanced, cross plied constructed laminates are available up to 36” x 48” in size.
Rogers DiClad Series laminates are fiberglass reinforced PTFE based composites for use as printed circuit board substrates in high frequency applications. The controlled fiberglass and PTFE content ratio enable DiClad laminates to offer a range of low dielectric constant (Dk) values. Higher PTFE content provides a lower Dk and loss tangent, while higher fiberglass content provides better dimensional stability and registration. Unlike the CuClad® laminate series, the DiClad laminates do not have cross plied constructions.
Rogers IM Series™ laminates include the IM cladding solution of an ultra-smooth electrodeposited copper foil cladding option which has excellent adhesion to the substrate materials. These laminates consist of a PTFE resin system and are woven glass reinforced for excellent dimensional stability.
Rogers IsoClad laminates are n on-woven fiberglass reinforced PTFE based composites for use as PCB substrates and radomes in high frequency applications. IsoClad laminates feature low dielectric constants (Dk) ranging from 2.17 to 2.33, low electrical loss of tan δ from 0.0009 to 0.0018 at X-band and low moisture absorption. These balanced, cross plied constructed laminates are available up to 48” x 54” in size.
Rogers Kappa 438 laminates were designed using a glass reinforced hydrocarbon ceramic system that offers superior high frequency performance and low cost circuit fabrication resulting in a low loss material which can be fabricated using standard epoxy/glass (FR-4) processes. Kappa 438 laminates also have the UL 94 V-0 flame retardant rating and are lead free solder process compatible. Kappa 438 laminates offer dielectric constants (Dk) tailored to FR-4 industry standard norms which facilities ease of converting existing FR-4 designs where better electrical performance is needed.
Rogers MAGTREX 555 high impedancelaminates are the first commercially available low loss laminate with controlled permeability and permittivity. MAGTREX™ 555 laminates enable antenna designers to expand the trade-space of their antenna design enabling design flexibility and optimization.
MAGTREX 555 materials are constructed from a proprietary, low loss, high resistivity ceramic filler and a high temperature thermoplastic matrix. This yields a system which is conformable, through hole via capable, and mechanically and electrically stable. These laminates feature a closely matched X/Y axis permeability and permittivity of 6 and 6.5, respectively, along with low magnetic and dielectric loss below 500 MHz. MAGTREX 555 high impedance laminates feature a low X, Y, Z CTE closely matched to copper for thermal reliability and are available in thicknesses from 40 to 260 mils. They are offered with or without copper cladding.
Rogers offers a wide arrangement of bonding and adhesion materials directly matched to complement our broad, industry-leading, high frequency circuit material offerings.
Rogers’ portfolio of prepregs and bondplys are designed for consistent reliability and performance for the most demanding multilayer PCB applications. With electrical and mechanical properties exceptionally matched to our high frequency laminates, our wide-range selection of non-reinforced and glass reinforced bonding and adhesion materials provides designers options for a total Rogers solution. Additionally, Rogers’ numerous families of bonding materials are developed on varying technologies, resulting in a range of solutions from the most challenging to traditional process ability methods.
Rogers RO3000 high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. This family of advanced laminates offers exceptional electrical and mechanical stability.
RO3000 Series laminates are circuit materials with consistent mechanical properties, regardless of the dielectric constant (Dk) selected. This allows the designer to develop multilayer board designs that use different dielectric constant materials for individual layers, without encountering war-page or reliability problems. Additionally, the RO3000 series’ dielectric constant is stable over a wide temperature range.
