Helen Frankenthaler PCB Circuit Board R&D Center

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PCB Capabilities | Bay Area Circuits

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PCB Capabilities

The following standard and advanced capabilities will assist printed circuit board (PCB) designers in setting up their basic design checks. Full capabilities for printed circuit board manufacturing may extend beyond the rules below but often times involve additional processes and costs to achieve the desired results. It is recommended that designers who require capabilities beyond what is described below contact us to help maximize the effectiveness of the design and the printed circuit board manufacturing process.

Overview

Standard CapabilityAdvanced Capability
Minimum Layer Count11
Maximum Layer Count1630
Trace/Space0.004″0.002″
Finished Hole Size0.006″0.004″
Surface FinishesHASL, ENIG, Hard Gold, Soft Gold (see all below)ENEPIG, OSP (see all below)
MaterialsFR-4, High Temp FR-4, Isola, Rogers, see material library for allPTFE/Duroid, Polyimide, Flex, see material library for all
Controlled Impedance+/- 10%+/- 5%
Annular Ring0.005″At drilled size, class 20.003″ Mechanical, 0.001″ Laser
Outer Layers Finished Copper1 oz to 2 oz1 oz to 5 oz
Inner Layers Finished Copper0.5 oz to 2 oz0.3 oz to 4 oz
Soldermask ColorsGreen, Black, Blue, Red, White, Clear, CustomYellow, Custom
Silkscreen ColorsGreen, Black, Blue, Red, White, Clear, CustomYellow, Custom
Filled ViasNon-Conductive FillNon-Conductive Fill or Conductive Fill
Smallest Mechanical Drill Diameter0.008″0.004″
Smallest Laser Drill DiameterN/A0.003″
Blind ViasNoYes
Buried ViasNoYes
Aspect Ratio10:115:1
Plated Hole to External Copper0.008″0.005″
Plated Hole to Internal Copper0.0105″0.008″
Clearance – Copper to Edge of BoardOuter Layer Rout – 0.010″ Outer Layer V-Score – 0.015″ Inner Layer – 0.015″Outer Layer Rout – 0.005″ Inner Layer Rout – 0.005″
Minimum Panel Size9″ x 12″8″ x 8″
Maximum Panel Size18″ x 24″24″ x 36″
Plated SlotsRoutedRouted or Nibbled
Non-Plated SlotsRoutedRouted or Nibbled
Plating in Holes0.0008″0.0015″
Web (or Mask Width)0.005″0.003″
Soldermask Swell0.003″0.001″
Silkscreen Width0.003″0.003″

Inspection & Testing Criteria

Standard CapabilityAdvanced Capability
IPC Class 2YesYes
IPC Class 3NoYes
Netlist Generation and Netlist CompareYesYes

Trace / Space

Outer Layers (finished copper)
Standard CapabilityAdvanced Capability
1 oz Cu Min Trace/Space .004″1 oz Cu Min Trace/Space .002″
2 oz Cu Min Trace/Space .006″2 oz Cu Min Trace/Space .005″
3 oz Cu Min Trace/Space .008″3 oz Cu Min Trace/Space .008″
4 oz Cu Min Trace/Space .012″4 oz Cu Min Trace .011″ Space .012″
5 oz Cu Min Trace/Space .016″
Inner Layers
Standard CapabilityAdvanced Capability
0.5 oz Cu Min Trace/Space .0035″0.3 oz Cu Min Trace/Space .002″
1 oz Cu Min Trace/Space .005″1 oz Cu Min Trace .004″ Space .005″
2 oz Cu Min Trace .006″ Space .008″2 oz Cu Min Trace .005 Space .007″
3 oz Cu Min Trace .009″ Space .010″
4 oz Cu Min Trace .012″ Space .015″

Drilling

Standard CapabilityAdvanced Capability
Min drilled diameter, final board thickness 0.031″ or less0.006″0.004″
Min drilled diameter, final board thickness between 0.031″ and 0.062″0.008″0.006″
Min drilled diameter, final board thickness between 0.062″ and 0.093″0.010″0.010″
Min drilled diameter, final board thickness between 0.093″ and 0.125″0.0145″0.012″
Min / Max laser drilled dielectricsN/A1.5 mil/6 mil
Min / Max micro via diameter -as ablated-N/A2.5 mil/8 mil
Min micro via capture/landing pad annular ringN/A2 mil
Micro Via Depth to Diameter Aspect RatioNo0.75:1 Greater upon review.
Pre-drilled core blind viasNoYes
Sublamination blind viasNoYes
HDI Via StructuresNo4+N+4 Greater or anylayer upon review
Buried viasNoYes
Filled viasNon-Conductive fillNon-Conductive or Conductive fill
NibblingNoYes
Largest hole0.247″ plated, 0.250″ non-platedNo maximum
SlotsPlated or non-plated, routedPlated or non-plated, routed or nibbled
Plating in holes0.0008″0.0015″
Plated hole to copper0.008″0.005″

Surface Finish

Standard CapabilityAdvanced Capability
Hot Air Solder Level (HASL – Lead)YesYes
Hot Air Solder Level (HASL – Lead-Free)YesYes
Electroless Nickel Immersion Gold (ENIG)YesYes
Immersion SilverYesYes
Hard Gold Fingers with ENIGYesYes
Hard Gold Fingers with HASLYesYes
Electrolytic Hard GoldYesYes
Electrolytic Soft GoldYesYes
Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG)NoYes
Organic Surface Protectant (OSP)YesYes
Bare CopperYesYes
Electroless Palladium Immersion Gold (EPIG)NoNo
Tin NickelNoYes
White TinYesYes
Carbon InkNoYes

Soldermask

Standard CapabilityAdvanced Capability
ColorsGreen, Black, Blue, Red, White, Clear, CustomYellow, Custom
Finish/TextureSemi-gloss, MatteSemi-gloss, Matte
Tented ViasNoYes
Soldermask Plugged ViasYesYes
Soldermask Thickness over Copper5 micron to 25 micron5 micron to 25 micron
Soldermask Web5 mil3 mil
Soldermask Gap to Pad4 mil2 mil
Copper Ring Under Mask-Defined Pad3 mil1 mil
Peelable SoldermaskNoYes
LPI SoldermaskYesYes
Dry Film SoldermaskNoYes

Silkscreen

Standard CapabilityAdvanced Capability
ColorsGreen, Black, Blue, Red, White, Clear, CustomYellow, Custom
Minimum Legend Width/Height.003″/.027″.003″/.024″
Space between Silkscreen and Pad5 mil4 mil

Controlled Impedance

Standard CapabilityAdvanced Capability
Layers2-16 Layers0-30 Layers
Impedance Tolerance -SE, Differential Pairs or Coplanar-+/- 10%+/- 5%
TDR TestingYes, IncludedYes, Included

Board Thickness

Standard CapabilityAdvanced Capability
1-Layer or 2-LayerMin .015″ | Max .200″Min .008″ | Max .250″
4-LayerMin .020″ | Max .200″Min .015″ | Max .250″
6-LayerMin .031″ | Max .200″Min .025″ | Max .250″
8-LayerMin .047″ | Max .200″Min .031″ | Max .250″
10-LayerMin .062″ | Max .200″Min .040″ | Max .250″
12-LayerMin .062″ | Max .200″Min .047″ | Max .250″
14-LayerMin .062″ | Max .200″Min .054″ | Max .250″
16-LayerMin .068″ / Max .200″Min .062″ | Max .250″
Laminate Materials

View our Material Library for details

CNC / Routing / Score / Mechanical Rules

Standard CapabilityAdvanced Capability
Router Bit Size.045″, .062″, .078″ & .093″Min .020″, Max .093″
Spacing for Tab Rout Array0.100″
Standard V- Score Angle30°20°, 30°, 45°, 60°
V-Score DepthOne third of board thickness (min 0.010