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Teflon PCBs: The Complete Guide to Understanding Their Impact and Uses

Teflon PCBs: The Complete Guide to Understanding Their Impact and Uses

Printed Circuit Boards (PCBs) form the backbone of all major electronics - essential for their internal function. Among various PCB materials, Teflon, the brand name for Polytetrafluoroethylene (PTFE), stands out for its superior properties. Teflon PCBs, known for their high frequency and heat resistance, have been transforming the electronics industry since their inception.

Teflon was invented by Roy Plunkett in 1938 and was later incorporated into PCB technology due to its exceptional dielectric properties. Over the years, Teflon PCBs have been increasingly used in complex and high-frequency electronics, proving crucial in the evolution of cutting-edge technology. From their initial application in military technology during the mid-20th century to their current use in advanced communication systems, Teflon PCBs have revolutionized the way we perceive and develop electronics.

What Is Teflon PCB?

A Teflon PCB, also known as a PTFE PCB, is a unique type of high-frequency printed circuit board that utilizes Polytetrafluoroethylene, better known as Teflon, a brand name by Dupont Corporation for its PTFE materials. This type of PCB is specifically designed to transmit signals at frequencies of 5GHz and above, making it an optimal choice for microwave and RF applications. The term "Teflon PCB" has become a common vernacular due to the popularity and widespread recognition of Dupont's brand.

In this article, you will get an insight into Teflon PCBs - what PTFE laminates are there to choose from, specifications of common Teflon PCBs, benefits and applications of Teflon PCBs, Teflon PCB manufacturing, etc.

Properties of Teflon PCB

A PCB made from Teflon exhibits exceptional mechanical, thermal, and electrical characteristics. It is particularly favored in scenarios that require superior frequency and temperature endurance. Here are some defining attributes of this type of printed circuit board:

  • Impressive Low-Temperature Durability: Teflon PCBs are extraordinarily resilient even in extreme cold, maintaining mechanical toughness and a 5% elongation at temperatures as low as -196 degrees Celsius.
  • Superb Resistance to Chemicals: Teflon PCBs are highly resistant to a wide array of chemicals, oils, and greases. Their intrinsic properties remain unaltered even when exposed to corrosive chemical environments.
  • Weather-Resilient: Teflon PCBs are celebrated for their ability to endure diverse and harsh weather conditions, underpinning their reliability and longevity.
  • Low Energy Dissipation: With a minimal dissipation factor, Teflon PCBs offer superior insulation properties, making them the preferred choice for high-precision and high-performance electronic systems like radar and radio frequency devices.
  • Superior Thermal Stability: Teflon PCBs can perform optimally even in environments with high temperatures, underscoring their versatility in heat-generating applications.
  • Non-reactive Nature: The robust bonds between the carbon and fluorine atoms in PTFE give Teflon PCBs their non-adhesive and non-stick nature, ensuring their unreactivity.
  • Minimal Water Absorption: Teflon PCBs are virtually impervious to moisture due to their low water absorption rate, making them suitable for operations in high-humidity environments.
  • Remarkable Electrical Qualities: Teflon PCBs are characterized by their low dielectric loss and consistent dielectric constant across an extensive frequency range. This, along with their high volume resistivity and breakdown voltage, makes them particularly effective in RF and microwave applications.

Specifications of Commonly Used Teflon PCBs

Here we list the specifications of the commonly used Teflon PCBs, including Rogers RO3003, RO3035, RO3006, RO3010, RT5870, RT5880, RT6002, RT6006, RT6010.2LM.

PropertyTypical ValueDirectionUnitConditionTest Method
RO3003RO3035RO3006RO3010
Dielectric Constant,ϵ r Process3.00±0.043.00±0.056.15±0.1510.2±0.30Z
Dielectric Constant,ϵ r Design3.003.606.5011.20Z
Dissipation Factor, tan δ0.00100.00150.00200.0022Z
Thermal Coefficient of ϵ r-3-45-262-395Z
Dimensional Stability-0.06 0.07-0.11 0.11-0.27 -0.15-0.35 -0.31X Y
Volume Resistivity10 710 710 510 5
Surface Resistivity10 710 710 510 5
Tensile Modulus930 8231025 10061498 12931902 1934X Y
Moisture Absorption0.040.040.020.05-
Specific Heat0.90.860.8
Thermal Conductivity0.500.500.790.95-
Coefficient of Thermal Expansion (-55 to 288℃)17 16 2517 17 2417 17 2413 11 16X Y Z
Td500500500500
Density2.12.12.62.8
Copper Peel Stength12.710.27.19.4
FlammabilityV-0V-0V-0V-0
Lead Free Process CompatibleYesYesYesYes
PropertyTypical ValueDirectionUnitConditionTest Method
RT/duroid 5870RT/duroid 5880
Dielectric Constant,ϵ r Process2.33 2.33±0.02 spec.2.20 2.20±0.02 spec.Z ZN/AC24/23/50 C24/23/50
Dielectric Constant,ϵ r Design2.332.20ZN/A8 GHz - 40 GHz
Dissipation Factor, tan δ0.0005 0.00120.0004 0.0009Z ZvC24/23/50 C24/23/50
Thermal Coefficient of ϵ r-115-125Zppm/℃-50 - 150℃
Volume Resistivity2 x 10 72 x 10 7vMohm cmC96/35/90
Surface Resistivity2 x 10 73 x 10 7ZvC96/35/90
Specific Heat0.96 (0.23)0.96 (0.23)N/AvN/A
Tensile ModulusTest at 23℃Test at 100℃Test at 23℃Test at 100℃N/A
1300 (189)490 (71)1070 (156)450 (65)X
1280 (185)430 (63)860 (125)380 (55)Y
Ultimate Stress50 (7.3)34 (4.8)29 (4.2)20 (2.9)X
42 (6.1)34 (4.8)27 (3.9)18 (2.6)Y
Ultimate Strain9.88.76.07.2X
9.88.64.95.8Y
Compressive Modulus30 (4.4)23 (3.4)27 (3.9)22 (3.2)X
37 (5.3)25 (3.7)29 (5.3)21 (3.1)Y
54 (7.8)37 (5.3)52 (7.5)43 (6.3)Z
Ultimate Stress30 (4.4)23 (3.4)27 (3.9)22 (3.2)X
37 (5.3)25 (3.7)29 (5.3)21 (3.1)Y
54 (7.8)37 (5.3)52 (7.5)43 (6.3)Z
Ultimate Strain4.04.38.58.4X
3.33.37.77.8Y
8.78.512.517.6Z
Moisture Absorption0.020.02N/A%.062" (1.6mm) D48/50
Thermal Conductivity0.220.20ZW/m/K80℃
Coefficient of Thermal Expansion22 28 17331 48 237X Y Zppm/℃0-100℃
Td500500N/A℃ TGAN/A
Copper Peel27.2 (4.8)31.2 (5.5)N/Apli (N/mm)1 oz (35mm) EDC foil after solder float
FlammabilityV-0V-0N/AN/AN/A
Density2.22.2N/Agm/cm 3N/A
Lead-Free Process CompatibleYesYesN/AN/AN/A
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PropertyTypical ValueDirectionUnitConditionTest Method
RT/duroid 6002
Dielectric Constant,ϵ r Process2.94±0.04Z-10 GHz/23℃IPC-TM-650, 2.5.5.5
Dielectric Constant,ϵ r Design2.948 GHz-40GHzDifferential Phase Length Method
Dissipation Factor, tan δ0.0012Z-10 GHz/23℃IPC-TM-650, 2.5.5.5
Thermal Coefficient of ϵ r+12Zppm/℃10 GHz 0-100℃IPC-TM-650, 2.5.5.5
Volume Resistivity10 6ZMohm cmAASTM D257
Surface Resistivity10 7ZMohmAASTM D257