Aluminum Microwave RF PCB for Power Supply

Ceramic Packages for Microwave Power Transistors (up to 20GHz)

Ceramic Packages, Ceramic Substrates, and Lids | Ceramic Packages / Ceramic Substrates | KYOCERA

Product Overview

Ceramic packages designed for high-frequency microwave power transistor applications, supporting operations up to 20GHz.

Key Features

• High-frequency performance up to 20GHz
• Superior thermal management
• Excellent reliability and hermetic sealing
• Designed for power transistor integration

Applications

Ideal for use in telecommunications, radar systems, satellite communications, and other high-frequency electronic systems requiring robust and reliable packaging solutions.

Technical Specifications